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Shanghai Lingee Tech Group focus on R&D of sensitive Material, Production of sensing elements and sets, providing a better sensing solutions. Main products are NTC thermistor (MEB Epoxy Resin coated thermistor, MG Glass-seale NTC themistor), C series sensor probe sets.

With Deep research and support from Academy of Sciences, new generation Material Engineer strive for expanding sensing application with our partners in terms of both deepening the basic theoretical research, and continuously optimizing the performance parameters, thermistor production and testing, industrialization.

 

All Lingeers are constantly seeking for new devices based on sensitive materials, providing the basic and important sensitive signal devices for smart life in China and the world.

领技技术
领技大楼
Chips
Lingee
会议照

R&D • Quality • Manufacturing • Supply
Think big, data speak; More accuracy to reduce risks to obtain stability; Safe and quick supply.
  • Thermal Sensitive Tech
  • Quality Assurance
  • Production & Supply
  • Material
    Sensitive materialBased on the research and formulation of metal oxide semiconductor ceramic materials, Lingeers are searching for more excellent sensitive materials and formulas to expand the application scenarios and performance of semiconductor devices.
     
  • Thermistors
    Thermistor components
    Thermistor has been made mainly by following process, ceramic wafer making, wafer cutting, chip sealing and testing, to realize the function.
  • Assembly
    Sensor probe assembly
    With the customization, intelligence, miniaturization, and integration of sensing appliaction, basic components are becoming more and more unable to meet the temperature sensing application scenarios. The market puts forward more personalized and customized component secondary packaging and testing requirements to achieve the effectiveness of equipment signal acquisition.
  • D&T
    sensor technology appliactions
    With the customization, intelligence, miniaturization, and integration of sensing appliaction, basic components are becoming more and more unable to meet the temperature sensing application scenarios. The market puts forward more personalized and customized component secondary packaging and testing requirements to achieve the effectiveness of equipment signal acquisition.
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